Stochastic Mechanical Characterization of Polysilicon MEMS: A Deep Learning Approach
نویسندگان
چکیده
منابع مشابه
Characterization of Selective Polysilicon Deposition for MEMS Resonator Tuning
Variations in micromachining processes cause submicron differences in the size of MEMS devices, which leads to frequency scatter in resonators. A new method of compensating for fabrication process variations is to add material to MEMS structures by the selective deposition of polysilicon. It is performed by electrically heating the MEMS in a 25 C silane environment to activate the local decompo...
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In order to characterize the fatigue behaviour and determine the fracture energy of polysilicon used in micro-systems, an on-chip testing device has been designed and fabricated. The experimental set-up is able to continuously measure the elastic stiffness decrease and therefore to evidence fatigue of polysilicon 15-μm thick films and to allow for the introduction of a sharp crack at the notch ...
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Three different kinds of two-port flexural resonators, with both clamped and free ends, and with nominal resonance frequencies between 5 MHz and 50 MHz, were designed and fabricated. Among them, a novel free-free third-mode resonator, as well as a tunable free-free resonator, designed to maintain a high quality factor despite its tunability, are presented. Because of reduced energy loss in the ...
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Mechanisms of microscale wear in siliconbased microelectromechanical systems (MEMS) are elucidated by studying a polysilicon nanotractor, a device specifically designed to conduct friction and wear tests under controlled conditions. Photoelectron emission microscopy (PEEM) was combined with near-edge X-ray absorption fine structure (NEXAFS) spectroscopy and atomic force microscopy (AFM) to quan...
متن کاملModeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach
Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the se...
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ژورنال
عنوان ژورنال: Proceedings
سال: 2019
ISSN: 2504-3900
DOI: 10.3390/ecsa-6-06574